Nacme Scholarships
The Autodesk NACME Scholarship is designed to provide financial support and work experience that will promote high academic achievement among under-represented students enrolled in an undergraduate computer science or computer engineering program. Applicants must be enrolled full-time, on campus, and in good standing in an accredited computer engineering or computer science program, and have demonstrated financial need. Preference is given to rising junior and rising senior applicants. Minimum 3.0 cumulative GPA on a 4.0 scale. The award is accompanied by a summer internship. The recipients will receive a one-time $5,000 award the academic year after the paid summer internship.
The Bechtel Undergraduate Scholarship Award is financial support program that encourages and recognizes high academic achievement of students interested in pursuing a corporate career in a construction-related engineering discipline. The award is accompanied by an internship and mentoring opportunities. Two students are selected in their junior year. The recipients are awarded $2,500 each for up to two years. The minimum grade point average required is 3.0 on a 4.0 scale.
Joint endowment established between NACME and New York University, Tandon School of Engineering. One high school senior is selected for funding beginning their freshman year and supported for a maximum of five years. The recipient is awarded $2,500 each year. The minimum grade point average required is 2.8 on a 4.0 scale.
The William Randolph Hearst Foundation supported the creation of this endowed scholarship. Two students are selected in either their freshman or sophomore year of an ungraduated program in engineering. The recipients are awarded $2,500 each for up to four years. The minimum grade point average required is 2.8 on a 4.0 scale.
Philip D. Reed endowment fellowship is made possible through an endowment from the Philip D. Reed Foundation. One student is selected in their sophomore year. The award provides $5,000 for up to three years.
NACME Scholarship |
Academic Year |
Min Cum GPA (4.0 scale) |
Qualifying Engineering or Comp Sci Major? |
Paid Summer Internship offered by sponsoring entity? |
Essay/ Special Questions Required? |
Renewable or One Time Award? |
Award Amount |
Deadline Date |
|
Bridge |
High School Senior/ Rising Freshman |
2.8 |
All |
Partner Institution with qualifying Bridge Program |
Priority applicant for internships as a Rising Sophomore |
No |
One Time |
Published Family Cost |
June 1 |
Collegiate (Block Grant) |
Freshman - Senior |
2.8 |
All |
All |
Priority applicant via the NACME Career Center |
No |
Renewable |
Varies by Partner Institution $1,500-$4,000 |
Dec 1 |
Americas Styrenics |
Rising Sophomore – Rising Junior |
2.75 |
All |
LSU Only |
No |
No |
2 years |
$6,000 |
Nov 15 |
Autodesk |
Rising Junior or Rising Senior |
3.0 |
Computer Science; Computer Engineering |
All |
Yes |
No |
One Time |
$5,000 |
Nov 15 |
Bechtel Undergraduate |
Junior |
3.0 |
Construction Related Engineering Major |
All |
Yes |
Yes |
2 years |
$2,500 |
Nov 15 |
Bechtel Women’s |
Junior or Senior |
3.0 |
Construction Related Engineering Major |
All |
Yes |
Yes |
One Time |
$10,000 |
Nov 15 |
Chevron |
Freshman-Senior |
3.0 |
All; Preferred: MechanicalChemical, Electrical, Civil, Petroleum, Computer Science |
All; Preferred: Florida International University, North Carolina A&T State University, Prairie View A&M University, Tuskegee University, University of Houston, and University of Illinois, Urbana Champaign |
Priority applicant |
Yes |
One Time |
$5,000 |
July 1 |
Friend |
High School Senior/ Rising Freshman |
2.8 |
All |
NYU Only |
No |
No |
Renewable up to five years |
$2,500 |
Nov 15 |
Hearst |
Freshman and Sophomore |
2.8 |
All |
All |
No |
No |
Renewable up to four years |
$2,500 |
Nov 15 |
Reed |
Sophomore |
2.8 |
All |
All |
No |
No |
Renewable up to 3 years |
$5,000 |
Nov 15 |